From June 5 to 9, 2016, Shanghai Huali Microelectronics Corporation (“HLMC”), a China leading 300mm pure-play wafer foundry, attended the 53rd Design Automation Conference (“DAC”) at Booth 1723 in Austin Convention Center, Texas of US.
The DAC is recognized as the premier conference for IC design and automation of electronic systems (EDA) and intellectual property (IP). This is the first time that HLMC appears in North American exhibition, although HLMC has been having many business collaborations with US customers. At the 53rd DAC this year, HLMC primarily exhibited a variety of most advanced IC manufacture technologies, including 55~40~28nm standard CMOS platforms and the related specialty process technologies, like RF, HV, CIS, e-Flash and so on. Many visitors were surprised by HLMC's presence this year as the representative of China leading pure-play wafer foundry and also impressed by HLMC's capabilities in advanced process technology nodes.
With the appearance of DAC this year, HLMC showed the world its global vision and strategy. The event also provides HLMC superb opportunities to build networking with IC design companies, IP vendors, researchers and tool developers in U.S.